Technologies

The designs that we have produced over the past decade have used every conceivable PCB technology available. Our experience working with the latest via technologies, specialist materials, high layer-counts and tight impedance control makes us confident that we can handle any design offered to us.
 
 
Via Technology: Blind, buried, HDI-via, micro-via, stacked- via...
 
      
 
The increasingly high I/O count of complex ICs, components with a pitch of 0.30mm or less (e.g. uBGAs) and ever increasing edge rates has necessitated the introduction of new interconnecting technologies to successfully complete designs.
     
As a result of these developing technologies, more boards in the future will suffer from high connection densities, finer lines and smaller holes. To gain more real-estate for placement and routing the implementation of microvia technology is a necessity being incorporated into may designs. Microvias can also be successfully utilised where via-in-pad technology allows multiple vias to be inserted into component lands to reduce the inductive effect of through- hole- vias (micro-vias have 1/10 the inductance and capacitance) as well as allowing direct connection of pads to an adjacent plane for heat-sinking purposes. By utilising microvias it is also possible to separate an RF circuit on one side of a board from a digital circuit on the other.
 
The correct implementation of microvias, stacked microvias and / or blind vias can resolve interconnection issues and open more design options. Our design experience combined with that of our manufacturing partners will enable you to adopt these new technologies and design methodologies with confidence.
 
 
Flex & Flex-rigid
 
 
 
There are many reasons why you may be considering implementing flex or flex-rigid laminates.
 
Miniaturisation
• Wire harness replacement
 Reduced assembly time
• Space and weight requirements
 
 
What are the advantages?
 
• Reliability - by replacing a wiring harness with tracking, wiring 
   errors can be eliminated
 Reduced weight - the flat thin nature of flex material, means reduced weight 
   over traditional interconnection methods.
• Space requirements - the flexibility of the types of board allow them to be bent  
   or twisted to fit into tight space constraints.
• Consistent electrical characteristics - as the manufacture of Flex boards 
   is a repeatable process the electrical characteristics, resistance, capacitance 
   and crosstalk are also consistent.
 
Flexible single and double-sided circuits are the most common constructions often combined with stiffeners or rigidisers for mounting components.
 
Flex-rigid boards are, as the name suggests, a combination of flex and rigid board technologies in which the flex part would normally contain tracking and the rigid part the component mounting areas.
 
Whatever your reasons for looking into this technology we have vast experience designing flex & flex-rigid boards for different applications and environments and can advise you on how best to introduce this technology to your products.
 
Again, our manufacturing partners can provide the necessary technical and manufacturing backup to our design service to ensure a smooth process through to finished boards.
 
If you feel your systems could benefit from flexi technology, please contact us to discuss your requirements.

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